Systems and methods for detecting scale deposits in a fluid heating device

ABSTRACT

The disclosed technology includes a tankless liquid heater system for detecting buildup on a heating element, including: a chamber; at least one heating element to heat liquid in the chamber; at least one sensor to detect data associated with identifying buildup on the at least one heating element; and at least one device to: receive the data detected by the at least one sensor; determine, based on the data, an amount of the buildup on the at least one heating element; and adjust an operation of the at least one heating element based on the amount of the buildup on the at least one heating element.

CROSS-REFERENCE TO RELATED PATENT APPLICATION(S)

This application claims the benefit of U.S. Provisional Application No. 63/365,042, filed May 20, 2022, the disclosure of which is incorporated by reference as set forth in full.

FIELD OF THE DISCLOSURE

The presently disclosed subject matter relates generally to detecting accumulation or buildup of materials (e.g., minerals and/or sediment) on a heating element of a fluid heating device.

BACKGROUND

Water heating systems can be used in a variety of applications, including industrial and residential applications. A major problem associated with water heating systems is that scale (e.g., chemical and/or mineral deposits), can form on a heating element or interior wall of a heating chamber in contact with water. Scale can occur when the water that flows through a water heating system includes chemical, sediment, and/or mineral contaminants, such as calcium and magnesium. When the water is heated, these mineral contaminants can become deposited onto the surface of heating chambers and/or heating elements of water heating systems. Instead of flowing through the system, these minerals can cling to the metal surface of a heating chamber or heating elements of the system. Typical signs of scaling include mineral deposits, stains, or a white film forming on a surface, and scaling can often appear on surfaces made of stainless steel, tile, glass, or other materials.

These mineral deposits can build up over time, causing numerous problems with the effectiveness and efficiency of a water heating system. For example, scaling can cause uneven heating of the water. This can be particularly true with tankless water heating systems, as mineral deposits can coat the heating element, which can inhibit heat transfer from the heating element to the water, thus making it more difficult for water to receive the anticipated amount of heat from the heating element. Additionally, scaling can provide an attractive environment for bacteria. Bacteria will commonly migrate towards scaling within water heating systems as a means to escape certain chemicals. Ultimately, scaling can diminish the life span of a heating element and/or overall water heating system, causing unnecessary financial costs for users and entities.

Accordingly, it is beneficial to ensure scale buildup (or scale buildup beyond a certain threshold) does not occur. However, it can be difficult to detect the presence of scale in certain fluid heating systems. For example, many systems require a user to at least partially disassemble the fluid heating system to remove and inspect the heating element for scale buildup. This can be difficult, cumbersome, and costly, and can also require downtime, as the fluid heating system cannot be used to heat water while the heating element is being removed for inspection.

SUMMARY

These and other problems can be addressed by embodiments of the technology disclosed herein. The disclosed technology relates to a fluid heating device that includes a heating chamber having a heating element. The disclosed technology includes one or more sensors for detecting scale buildup.

The one or more sensors can include one or more temperature sensors configured to measure a temperature change difference as fluid moves across the heating element. The temperature change difference can be compared to an anticipated temperature change corresponding to the absence of scale buildup and/or can be used to calculate an estimate amount or thickness of scale buildup according to a predetermined relationship involving at least the measured temperature change (i.e., the difference between water temperature at first and second locations).

The one or more sensors can include an infrared camera configured to obtain infrared data (e.g., infrared images) of a heating element, and the controller can be configured to analyze the infrared data, such as by comparing current infrared data to previous infrared data and/or stored infrared data corresponding to various amounts and thicknesses of scale buildup on the same or similar (e.g., same model, same type) of heating element. Based on such analysis, the controller can be configured to detect the presence and/or amount or thickness of scale buildup.

The one or more sensors can include a pressure sensor. The pressure sensor can be configured to obtain pressure measurements relating to a pressure drop across the heating element, and the controller can be configured to estimate an amount of scale buildup present on or near the heating element based on the measured pressure drop.

The one or more sensors can include a pressure sensor that is or includes a touch probe. The touch probe can measure thickness of an object relative a surface area of the heating element. Increased thickness can be attributed to increased scale buildup. The controller can receive pressure data and determine a thickness of the scale buildup at a specific location along the heating element (i.e., the location being measured by the touch probe).

The one or more sensors can include a temperature sensor located within a sheath of the heating element, which can be configured to measure the temperature of the heating element. Increased temperatures of the heating element, assuming a constant energy supply and/or intended heat output, can be indicative of increased scale buildup, which has insulative properties.

The one or more sensors can include one or more resistive sensors, which can be configured to measure a water column resistance associated with the heating element. Increased resistance can be indicative of scale buildup.

These and other aspects of the present disclosure are described in the Detailed Description below and the accompanying figures. Other aspects and features of the present disclosure will become apparent to those of ordinary skill in the art upon reviewing the following description of specific examples of the present disclosure in concert with the figures. While features of the present disclosure may be discussed relative to certain examples and figures, all examples of the present disclosure can include one or more of the features discussed herein. Further, while one or more examples may be discussed as having certain advantageous features, one or more of such features may also be used with the various other examples of the disclosure discussed herein. In similar fashion, while examples may be discussed below as devices, systems, or methods, it is to be understood that such examples can be implemented in various devices, systems, and methods of the present disclosure.

BRIEF DESCRIPTION OF THE FIGURES

Reference will now be made to the accompanying figures, which are not necessarily drawn to scale.

FIG. 1A is a front perspective of a fluid heating device, in accordance with the disclosed technology.

FIG. 1B is a perspective of a fluid heating device, in accordance with the disclosed technology.

FIGS. 2A and 2B illustrate diagrams of example relationships between change in water temperature and the thickness of scale buildup on a heating element, in accordance with the disclosed technology.

FIG. 3 illustrates a diagram of a time to temperature for an example fluid heating device both without scale buildup and with a certain amount of scale buildup, in accordance with the disclosed technology.

FIG. 4 illustrates a heating element and an infrared sensor, in accordance with the disclosed technology.

FIG. 5 illustrates a heating element and a pressure sensor, in accordance with the disclosed technology.

FIG. 6 illustrates a heating element and a temperature sensor, in accordance with the disclosed technology.

FIG. 7 illustrates a heating element and multiple resistive sensors, in accordance with the disclosed technology.

FIG. 8 is a schematic diagram illustrating various components in communication with a controller of an example fluid heating device, in accordance with the disclosed technology.

DETAILED DESCRIPTION

The disclosed technology relates to a fluid heating device that can include a heating chamber in communication with a heating element that is used to heat fluid flowing through the fluid heating device, and one or more sensors for detecting scale buildup, as will be described more fully herein. Once a certain amount of scale buildup has been detected, the disclosed technology can alert a user and/or disable the fluid heating device (e.g., to prevent damage).

Examples of the disclosed technology are discussed herein with reference to heating “fluid” or “water.” It is to be appreciated that the disclosed technology can be used with a variety of fluids, including water. Thus, while some examples may be described in relation to heating water specifically, all examples of the disclosed technology can be used with fluids other than water unless otherwise specified.

The disclosed technology is referenced herein in relation to a “heating chamber,” which can reference an area or portion of a fluid heating device in which heat is provided and/or transferred to a fluid. The fluid heating device, and the heating components thereof, can be powered by electricity, gas, or any other energy source.

The disclosed technology will be described more fully hereinafter with reference to the accompanying drawings. This disclosed technology can, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein. The components described hereinafter as making up various elements of the disclosed technology are intended to be illustrative and not restrictive. Many suitable components that would perform the same or similar functions as components described herein are intended to be embraced within the scope of the disclosed electronic devices and methods. Such other components not described herein can include, but are not limited to, for example, components developed after development of the disclosed technology.

In the following description, numerous specific details are set forth. But it is to be understood that examples of the disclosed technology can be practiced without these specific details. In other instances, well-known methods, structures, and techniques have not been shown in detail in order not to obscure an understanding of this description. References to “one embodiment,” “an embodiment,” “example embodiment,” “some embodiments,” “certain embodiments,” “various embodiments,” etc., indicate that the embodiment(s) of the disclosed technology so described can include a particular feature, structure, or characteristic, but not every embodiment necessarily includes the particular feature, structure, or characteristic. Further, repeated use of the phrase “in one embodiment” does not necessarily refer to the same embodiment, although it can.

Throughout the specification and the claims, the following terms take at least the meanings explicitly associated herein, unless the context clearly dictates otherwise. The term “or” is intended to mean an inclusive “or.” Further, the terms “a,” “an,” and “the” are intended to mean one or more unless specified otherwise or clear from the context to be directed to a singular form.

Unless otherwise specified, the use of the ordinal adjectives “first,” “second,” “third,” etc., to describe a common object, merely indicate that different instances of like objects are being referred to, and are not intended to imply that the objects so described should be in a given sequence, either temporally, spatially, in ranking, or in any other manner.

FIGS. 1A and 1B illustrate an example fluid heating device. While FIGS. 1A and 1B depict a particular arrangement of certain components, the disclosed technology is not so limited and also includes other arrangements that can include additional or fewer components than those expressly shown and described herein.

The fluid heating device 100 can include a heating chamber 102, a heating element 104, a flow sensor 110, one or more temperature sensor(s) 116, 118, a controller 114, and an ultrasonic transducer assembly 122. The fluid heating device 100 can include a single heating chamber 102. Alternatively, the fluid heating device 100 can include multiple heating chambers 102. Regardless of the number of heating chambers 102, each heating chamber 102 can include a heating element 104, for example, as illustrated in FIG. 1A. Alternatively, a given heating chamber 102 can include multiple heating elements 104. Each heating element 104 can be made of metal, such as copper, nickel, aluminum, molybdenum, iron, tungsten, or an alloy including these and/or other materials. The heating element 104 can have any useful form or shape. For example, the heating element can be a wire, ribbon, or can comprise metal foil. The heating element 104 can include ceramic, plastic, or silicone impregnated with a conductor. The heating element 104 can be an electrical resistance heating element, which can convert electrical energy into thermal energy when the heating element 104 is subject to an electrical current.

The flow sensor 110 can be in electrical communication with the controller 114. The flow sensor 110 can be positioned near the fluid inlet 106, as illustrated in FIG. 1A, although the flow sensor 110 can be positioned in other positions provided the flow sensor 110 is in a position where it can detect whether fluid is flowing through or out of the fluid heating device 100. The flow sensor 110 can be configured to detect the flow of fluid through or out of the heating chamber 102 and can transmit flow data to the controller 114.

The fluid heating device 100 can include one or more temperature sensors 116, 118 that are located at one or more locations within or near the fluid heating device, and the temperature sensor(s) 116, 118 can be in electrical communication with the controller 114. The temperature sensor(s) 116, 118 can be, for example, a thermometer, a thermistor, a thermocouple, a resistance thermometer, or any other temperature measuring device. As shown in FIG. 1A, an inlet temperature sensor 116 can be located at or near an inlet of the heating chamber 102 and an outlet temperature sensor 118 can be located at or near an outlet of the heating chamber 102. Each temperature sensor 116, 118 can be configured to detect the temperature of the fluid at the location of the inlet temperature sensor 116 and/or outlet temperature sensor 118 and can transmit temperature data to the controller 114.

The controller 114 can be configured to receive data from various sensors and components (e.g., flow sensor 110, heating element 104, temperature sensors, 116, 118), determine actions to be performed by one or more components based on the received data, and output instructions to perform those actions. The controller 114 can be mounted on the fluid heating device 100 or can be located remotely from the fluid heating device 100. The controller 114 can be configured to regulate the flow of electric current to the one or more heating elements 104. The controller 114 can output a control signal directly to the heating element 104, and the control signal can include instructions regarding whether to permit flow of current to generate heat, how much current to permit, and/or how much heat to generate. The controller 114 can output a control signal to individually activate a single heating element 104. Alternatively, the controller 114 can output a control signal to activate some or all heating elements 104 simultaneously. The one or more heating element(s) 104 can receive power via electrical wires and can be configured to provide the instructed the desired amount of heat.

The controller 114 can regulate flow of electrical current to one or more heating elements 104 based on data received from a sensor or other component of the fluid heating system 100, such as an inlet temperature sensor 116, outlet temperature sensor 118, or flow sensor 110. For example, the controller 114 can determine, based on flow data received from the flow sensor 110, that water is being requested and can output instructions to the heating element 104 to engage. As another example, the controller 114 can determine, based on temperature data received from an inlet temperature sensor 116, that the temperature of incoming water is below a requested water temperature and can output instructions to the heating element 104 to heat the water an appropriate amount, depending on the incoming water temperature and the requested water temperature. As another example, the controller 114 can determine, based on based on temperature data received from an outlet temperature sensor 118, that the temperature of outgoing water is below a requested water temperature and can output instructions to the heating element 104 to heat the water an appropriate amount, depending on the incoming water temperature and the requested water temperature.

The controller 114 can be configured to control and regulate the temperature of the heating element 104. The outlet temperature sensor 118 can detect the temperature of the fluid flowing out of the fluid outlet 108 and can send a signal to the controller 114, allowing the controller 114 to ensure the temperature of the fluid is approximately the same temperature as the determined threshold set using the temperature controller 112. The fluid heating device 100 can further include a thermostat, which can optionally perform some or all of the functionalities of the controller 114.

The controller 114 can be configured to calculate an estimated amount of scale buildup based at least in part on temperature measurements taken at the inlet side of the heating element 104 and the outlet side of the heating element 104. Such measurements can be measured and transmitted by the inlet temperature sensor 116 and/or outlet temperature sensor 118, respectively. Alternatively or in addition, the temperature measurements can be taken at locations proximate the heating element 104 (e.g., within the heating chamber 102 in which the heating element 104 is located) or at a distance apart from the heating element 104 (e.g., at or near the fluid inlet 106, at or near the fluid outlet 108, in a conduit or other chamber fluidly connected to the heating chamber 102).

Regardless of the specific positioning of the temperature sensors, the controller 114 can be configured to receive temperature data (e.g., inlet water temperature data and outlet water temperature data) from a first temperature sensor measuring water temperature at a first location and a second temperature sensor measuring water temperature at a second location that is downstream from the first location. The controller 114 can be configured to determine an estimated scale thickness based on the calculated temperature difference. For example, the controller 114 can be configured to calculate the estimated scale thickness based on a predetermined relationship between changes in water temperature (corresponding to the measurement locations) and a corresponding amount (e.g., thickness) of scale buildup.

As will be appreciated, a heating element 104 can be configured to output a predetermined (e.g., non-variable) amount of heat. Thus, a certain increase in temperature can be expected between the first and second measurement locations, assuming that heat transfer from the heating element 104 to the passing water is unhindered. However, as explained, increased deposits, such as scale, on the heating element 104 can decrease the amount of heat being transferred to the water and can ultimately damage or disable the heating element 104. As such, a lower-than-anticipated increase in water temperature between the first and second measurement locations can be indicative of scale buildup on the heating element 104.

Examples of relationships between the change in water temperature between two measurement locations and the thickness of scale on the heating element 104 are shown in FIGS. 2A and 2B. The controller 114 can be configured to estimate the amount or thickness of scale buildup on the heating element 104 based at least in part on the linear relationship illustrated in FIG. 2A. Alternatively or in addition, the controller can be configured to estimate the amount or thickness of scale buildup on the heating element 104 based at least in part on the polynomial relationship illustrated in FIG. 2B. Alternatively or in addition, the controller 114 can be configured to calculate the estimated amount or thickness of scale buildup on the heating element 104 based at least in part on any other predetermined relationship between change in water temperature and amount or thickness of scale buildup on the heating element 104.

As will be appreciated, the appropriate relationship between the change in water temperature and the corresponding amount or thickness of scale buildup can depend on the flow rate of water passing along the heating element 104 and/or the heat output of the heating element 104 (e.g., for adjustable or modulating heating elements). As such, the controller 114 can be configured to calculate an estimated amount or thickness of scale buildup on a heating element 104 based on different relationships corresponding to different flow rates and/or different heat outputs of the heating element 104. As such, the controller 114 can be configured to receive flow data from the flow sensor 110 and/or data indicative of a current heat output setting (e.g., received from the heating element 104 and/or based on an amount of energy currently being supplied to the heating element 104). As stated, the controller 114 can be configured to implement different relationships for different flow rates and/or heat outputs. Alternatively or in addition, the controller 114 can be configured to implement a single relationship that includes as variables an upstream water temperature, a downstream water temperature, a water flow rate, and/or a heat output (or amount of energy supplied to the heating element 104) to thereby determine an estimated amount or thickness of scale buildup.

Alternatively or in addition, the controller 114 can be configured to output instructions for adjusting the heat output of the heating element 104 based at least in part on the estimated amount or thickness of scale buildup. For example, controller 114 can be configured to increase the amount of heat output (e.g., by controlling the heating element 104 and/or the amount of energy being supplied to the heating element 104) as the amount or thickness or scale increases. To prevent damage to the heating element 104 and/or the overall fluid heating device 100, the controller 114 can be configured to increase the heat output of the heating element 104 to a predetermined, maximum heat output threshold. Once the threshold is met, the controller 114 can cease increasing the heat output of the heating element 104. That is to say, the controller 114 can prevent the heating element 104 from outputting heat above the maximum heat output threshold. Alternatively or in addition, upon reaching the maximum heat output threshold, the controller 114 can be configured to output an alert (e.g., via a display of the fluid heating device, to a remote computing device). Alternatively or in addition, upon reaching the maximum heat output threshold, the controller 114 can be configured to disable the heating element 104.

Referring to FIG. 3 , the controller 114 can be configured to calculate a time to temperature for the fluid heating device 100 based at least in part on the amount or thickness of scale buildup on the heating element 104. As will be appreciated, increased scale buildup will decrease the time to temperature, meaning that a larger amount of time is required for the fluid heating device 100 to sufficiently heat water when scale buildup is present as compared to when scale buildup is not present. FIG. 3 illustrates a difference in time to temperature for a fluid heating device 100 with and without an example amount or thickness of scale buildup on the heating element 104. Thus, the controller 114 can be configured to determine a response time for the outlet temperature to reach a predetermined temperature value under certain flow conditions and/or heat output.

Referring to FIG. 4 , the fluid heating device 100 can include an infrared (IR) sensor 410, such as an infrared camera. The chamber 102 can include an aperture or opening, and the opening can be covered with a window 412 (e.g., glass, plastic) to permit a view of the heating element while ensuring the chamber 102 remains fluid-tight. The IR sensor can alternatively be located within the chamber 102 itself such that the window 412 is not required or included. However, such positioning of the IR sensor 410 can inhibit fluid flow through the chamber, which may be undesirable in certain cases. Regardless, the IR sensor 410 can be positioned such that the IR sensor 410 can be configured to obtain IR image data of the heating element 104. Based on the IR image data, the controller 114 can be configured to determine an estimated amount of scale buildup on the heating element 104. For example, the controller 114 can be configured to determine an amount or percentage of surface area of the heating element 104 covered by scale. Alternatively or in addition, the controller 114 can be configured to determine a thickness of the scale buildup at a given location on the heating element 104. To determine the thickness of scale buildup, the controller 114 can be configured to analyze IR data and compare the obtained IR data to stored data indicative of corresponding scale buildup thickness. Alternatively or in addition, the controller 114 can be configured to compare current IR data or previous IR data corresponding to IR data relating to the heating element 104 and obtained at an earlier time such that trends in scale buildup.

While FIG. 4 illustrates an IR sensor 410, the fluid heating device 100 can, alternatively or in addition, include a sonar system configured to obtain sonar data relating to the heating element 104 and corresponding scale buildup. Detection of scale buildup using sonar data can be achieved in the same, or substantially the same, manner as with the IR data, as described herein.

As shown in FIG. 5 , the fluid heating device 100 can include a pressure sensor 510 configured to detect pressure in the chamber 102 or any other portion of the fluid heating device 100 through which the fluid flows. The fluid heating device 100 can include any number of pressure sensors 510, such as an upstream pressure sensor 510 at an upstream location from the heating element 104 and a downstream pressure sensor 510 at a downstream location from the heating element 104. The controller 114 can be configured to receive pressure data from the pressure sensor(s) 510. In the case of an upstream pressure sensor 510 and a downstream pressure sensor 510 being present, the controller 114 can be configured to measure a pressure drop across the heating element 104. Alternatively, the upstream pressure sensors 510 can be known or assumed such that only the downstream pressure sensor 510 is included or needed to determine the pressure drop across the heating element 104. As will be appreciated, the pressure drop can increase as the amount or scale buildup on the heating element 104 increases. Thus, the controller 114 can be configured to estimate the amount of scale buildup on the heating element 104 (or within the chamber 102, generally) based at least in part on the pressure drop (e.g., according to a relationship based at least in part on the pressure drop). If a predetermined pressure drop is reached, the controller 114 can be configured to increase the heat output of the heating element 104 to a predetermined, maximum heat output threshold. Once the maximum heat output threshold is met and/or a predetermined maximum pressure drop threshold is met, the controller 114 can cease increasing the heat output of the heating element 104. Alternatively or in addition, upon reaching the maximum heat output threshold and/or the predetermined maximum pressure drop threshold, the controller 114 can be configured to output an alert (e.g., via a display of the fluid heating device, to a remote computing device). Alternatively or in addition, upon reaching the maximum heat output threshold and/or the predetermined maximum pressure drop threshold, the controller 114 can be configured to disable the heating element 104.

Alternatively or in addition, the pressure sensor 510 can be or include a touch probe configured to contact the heating element 104 and/or scale buildup on the heating element 104. The touch probe can extend into the chamber 102, and the touch probe can be selectively extended and retracted relative the heating element 104. As such, the touch probe can determine a position, relative the side wall and/or relative an expected position of the heating element 104. If the touch probe contacts an object closer to the side wall than the expected position, the controller 114 can determine that scale buildup is present and extends from the heat element's 104 surface to the position at which the touch probe detected the object.

Alternatively, the touch probe can be static and can be configured to detect the thickness of scale buildup. As the thickness of scale buildup increases, the touch probe can become increasingly depressed. The touch probe can transmit pressure data to the controller 114, and the controller 114 can be configured to determine a thickness of the scale buildup based at least in part on the pressure data. If a predetermined pressure (or distance from the surface of the heating element 104, as measured by the touch probe) is reached, the controller 114 can be configured to increase the heat output of the heating element 104 to a predetermined, maximum heat output threshold. Alternatively or in addition, once the maximum heat output threshold is met and/or a predetermined maximum pressure threshold is met, the controller 114 can cease increasing the heat output of the heating element 104. Alternatively or in addition, upon reaching the maximum heat output threshold and/or the predetermined maximum pressure threshold, the controller 114 can be configured to output an alert (e.g., via a display of the fluid heating device, to a remote computing device). Alternatively or in addition, upon reaching the maximum heat output threshold and/or the predetermined maximum pressure threshold, the controller 114 can be configured to disable the heating element 104.

Referring to FIG. 6 , a temperature sensor 616 (which could be or include inlet temperature sensor 116), such as a thermocouple or thermistor or the like, can be located internal to sheathing (e.g., if the heating element 104 is a sheathed heating element). The temperature sensor 616 can be configured to obtain temperature measurements of the heating element 104 and transmit corresponding temperature data indicative of the temperature measurements to the controller 114. The controller 114 can be configured to analyze the temperature data over time. An increase in the temperature measured by the temperature sensor 616, particularly given a steady intended heat output of the heating element 104, can be indicative of increased scale buildup, as less heat is able to be transferred to the passing fluid. If a predetermined temperature measured by the temperature sensor 616 is reached, the controller 114 can be configured to increase the heat output of the heating element 104 to a predetermined, maximum heat output threshold. Alternatively or in addition, if a maximum temperature threshold is met, the controller 114 can cease increasing the heat output of the heating element 104. Alternatively or in addition, if the predetermined temperature measured by the temperature sensor 616 is reached, the controller 114 can be configured to output an alert (e.g., via a display of the fluid heating device, to a remote computing device). Alternatively or in addition, if the predetermined temperature (or the maximum heat output threshold) is reached, the controller 114 can be configured to disable the heating element 104.

Referring to FIG. 7 , the fluid heating device 100 can be configured to measure water column resistance to determine the presence and/or amount of scale buildup on the heating element 104. Water column resistance can be measured between any single sensor 710 and a reference point and/or between any two or more sensors 710. The sensor(s) 710 (illustrated as sensors 710 a-710 e and referenced generally herein as sensor(s) 710) can be any useful type of resistive sensor. When the heating element 104 is free of scale buildup, the conductive metal of the heating element 104 can act as a zero-resistance (or substantially zero-resistance) section in the water column. However, when scale buildup occurs (as little as a continuous deposit layer that is a single molecule thick), the resistance of the water column can change significantly. FIG. 7 illustrates several example locations at which a sensor 710 can be located. As an illustrative example, the water column resistance between sensors 710 a and 710 b can be the sum of the resistance measured by sensor 710 a and the resistance measured by sensor 710 b, as the resistance along the heating element 104 will be zero (or a near-zero value). After scale buildup occurs, the measured water column resistance can be the sum of the resistance measured by sensor 710 a, the resistance measured by sensor 710 b, and the resistance associated with the scale buildup.

If a predetermined resistance is reached, the controller 114 can be configured to increase the heat output of the heating element 104 to a predetermined, maximum heat output threshold. Alternatively or in addition, once the maximum heat output threshold is met and/or a predetermined maximum resistance threshold is met, the controller 114 can cease increasing the heat output of the heating element 104. Alternatively or in addition, upon reaching the maximum heat output threshold and/or the predetermined maximum resistance threshold, the controller 114 can be configured to output an alert (e.g., via a display of the fluid heating device, to a remote computing device). Alternatively or in addition, upon reaching the maximum heat output threshold and/or the predetermined maximum resistance threshold, the controller 114 can be configured to disable the heating element 104.

Referring to FIG. 8 , a single controller 114 can be configured to perform all of the methods and/or controller functions discussed herein. That is to say, the controller 114 can receive data from any of the sensors described herein (or any other sensor), make determinations and/or perform methods based at least in part on the received data, and/or output instructions to one or more components (e.g., the heating element 104), which can be based at least in part on determinations made by the controller 114. Alternatively, some or all of the steps of the various methods and processes described herein can be split among multiple controllers 114.

In one or more embodiments, the controller 114 may represent one or more devices. The controller 114 may operate as a standalone device or may be connected (e.g., networked) to other machines. The controller 114 may operate on logic or a number of components, modules, or mechanisms. Modules are tangible entities (e.g., hardware) capable of performing specified operations when operating. A module includes hardware. In an example, the hardware may be specifically configured to carry out a specific operation (e.g., hardwired). In another example, the hardware may include configurable execution units (e.g., transistors, circuits, etc.) and a computer readable medium containing instructions where the instructions configure the execution units to carry out a specific operation when in operation. The configuring may occur under the direction of the executions units or a loading mechanism. Accordingly, the execution units are communicatively coupled to the computer-readable medium when the device is operating. In this example, the execution units may be a member of more than one module. For example, under operation, the execution units may be configured by a first set of instructions to implement a first module at one point in time and reconfigured by a second set of instructions to implement a second module at a second point in time.

In one or more embodiments, the controller 114 may represent one or more hardware processors, memory, storage devices, signal generation devices, and/or buildup detection devices (e.g., capable of performing the buildup analysis as described herein). The controller 114 may include a machine-readable medium on which may be stored one or more sets of data structures or instructions (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein. The instructions may also reside, completely or at least partially, within the memory of the controller 114, or within the hardware processor of the controller 114 during execution thereof by the controller 114. In an example, one or any combination of the hardware processor, the memory, or the storage device of the controller 114 may constitute machine-readable media.

Further, multiple sensors have been described herein. It is to be understood that one, some, or all of the heretofore described sensors can be located at multiple locations along the length of the heating element 104, which can help provide a more complete estimate of the amount of scale buildup present along the length of the heating element.

Various embodiments may be implemented fully or partially in software and/or firmware. This software and/or firmware may take the form of instructions contained in or on a non-transitory computer-readable storage medium. Those instructions may then be read and executed by one or more processors to enable performance of the operations described herein. The instructions may be in any suitable form, such as but not limited to source code, compiled code, interpreted code, executable code, static code, dynamic code, and the like. Such a computer-readable medium may include any tangible non-transitory medium for storing information in a form readable by one or more computers, such as but not limited to read only memory (ROM); random access memory (RAM); magnetic disk storage media; optical storage media; a flash memory, etc.

The term “machine-readable medium” may include any medium that is capable of storing, encoding, or carrying instructions for execution by the controller 114 and that cause the controller 114 to perform any one or more of the techniques of the present disclosure, or that is capable of storing, encoding, or carrying data structures used by or associated with such instructions. Non-limiting machine-readable medium examples may include solid-state memories and optical and magnetic media. In an example, a massed machine-readable medium includes a machine-readable medium with a plurality of particles having resting mass. Specific examples of massed machine-readable media may include non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), or electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

When the controller 114 is remote from the fluid heating device 100, the instructions used by the controller 114 may further be transmitted or received over a communications network using a transmission medium via a network interface device/transceiver of the controller 114 utilizing any one of a number of transfer protocols (e.g., frame relay, internet protocol (IP), transmission control protocol (TCP), user datagram protocol (UDP), hypertext transfer protocol (HTTP), etc.). Example communications networks may include a local area network (LAN), a wide area network (WAN), a packet data network (e.g., the Internet), mobile telephone networks (e.g., cellular networks), plain old telephone (POTS) networks, wireless data networks (e.g., Institute of Electrical and Electronics Engineers (IEEE) 602.11 family of standards known as Wi-Fi®, IEEE 602.16 family of standards known as WiMax®), IEEE 602.15.4 family of standards, and peer-to-peer (P2P) networks, among others. The term “transmission medium” shall be taken to include any intangible medium that is capable of storing, encoding, or carrying instructions for execution by the fluid heating device 100 and includes digital or analog communications signals or other intangible media to facilitate communication of such software.

The operations and processes described and shown above may be carried out or performed in any suitable order as desired in various implementations. Additionally, in certain implementations, at least a portion of the operations may be carried out in parallel. Furthermore, in certain implementations, less than or more than the operations described may be performed.

The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

As used within this document, the term “communicate” is intended to include transmitting, or receiving, or both transmitting and receiving. This may be particularly useful in claims when describing the organization of data that is being transmitted by one device and received by another, but only the functionality of one of those devices is required to infringe the claim. Similarly, the bidirectional exchange of data between two devices (both devices transmit and receive during the exchange) may be described as “communicating,” when only the functionality of one of those devices is being claimed. The term “communicating” as used herein with respect to a wireless communication signal includes transmitting the wireless communication signal and/or receiving the wireless communication signal. For example, a wireless communication unit, which is capable of communicating a wireless communication signal, may include a wireless transmitter to transmit the wireless communication signal to at least one other wireless communication unit, and/or a wireless communication receiver to receive the wireless communication signal from at least one other wireless communication unit.

As used herein, unless otherwise specified, the use of the ordinal adjectives “first,” “second,” “third,” etc., to describe a common object, merely indicates that different instances of like objects are being referred to and are not intended to imply that the objects so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.

Some embodiments of the controller 114 may be used in conjunction with various devices and systems, for example, a personal computer (PC), a desktop computer, a mobile computer, a laptop computer, a notebook computer, a tablet computer, a server computer, a handheld computer, a handheld device, a personal digital assistant (PDA) device, a handheld PDA device, an on-board device, an off-board device, a hybrid device, a vehicular device, a non-vehicular device, a mobile or portable device, a consumer device, a non-mobile or non-portable device, a wireless communication station, a wireless communication device, and the like.

Some embodiments of the controller 114 may be used in conjunction with one or more types of wireless communication signals and/or systems following one or more wireless communication protocols, for example, radio frequency (RF), infrared (IR), frequency-division multiplexing (FDM), orthogonal FDM (OFDM), time-division multiplexing (TDM), time-division multiple access (TDMA), extended TDMA (E-TDMA), general packet radio service (GPRS), extended GPRS, code-division multiple access (CDMA), wideband CDMA (WCDMA), CDMA 2000, single-carrier CDMA, multi-carrier CDMA, multi-carrier modulation (MDM), discrete multi-tone (DMT), Bluetooth®, global positioning system (GPS), Wi-Fi, Wi-Max, ZigBee, ultra-wideband (UWB), global system for mobile communications (GSM), 2G, 2.5G, 3G, 3.5G, 4G, fifth generation (5G) mobile networks, 3GPP, long term evolution (LTE), LTE advanced, enhanced data rates for GSM Evolution (EDGE), or the like. Other embodiments may be used in various other devices, systems, and/or networks.

It is understood that the above descriptions are for purposes of illustration and are not meant to be limiting.

Although specific embodiments of the disclosure have been described, one of ordinary skill in the art will recognize that numerous other modifications and alternative embodiments are within the scope of the disclosure. For example, any of the functionality and/or processing capabilities described with respect to a particular device or component may be performed by any other device or component. Further, while various illustrative implementations and architectures have been described in accordance with embodiments of the disclosure, one of ordinary skill in the art will appreciate that numerous other modifications to the illustrative implementations and architectures described herein are also within the scope of this disclosure.

Program module(s), applications, or the like disclosed herein may include one or more software components including, for example, software objects, methods, data structures, or the like. Each such software component may include computer-executable instructions that, responsive to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

A software component may be coded in any of a variety of programming languages. An illustrative programming language may be a lower-level programming language such as an assembly language associated with a particular hardware architecture and/or operating system platform. A software component comprising assembly language instructions may require conversion into executable machine code by an assembler prior to execution by the hardware architecture and/or platform.

Another example programming language may be a higher-level programming language that may be portable across multiple architectures. A software component comprising higher-level programming language instructions may require conversion to an intermediate representation by an interpreter or a compiler prior to execution.

Other examples of programming languages include, but are not limited to, a macro language, a shell or command language, a job control language, a script language, a database query or search language, or a report writing language. In one or more example embodiments, a software component comprising instructions in one of the foregoing examples of programming languages may be executed directly by an operating system or other software component without having to be first transformed into another form.

A software component may be stored as a file or other data storage construct. Software components of a similar type or functionally related may be stored together such as, for example, in a particular directory, folder, or library. Software components may be static (e.g., pre-established or fixed) or dynamic (e.g., created or modified at the time of execution).

Software components may invoke or be invoked by other software components through any of a wide variety of mechanisms. Invoked or invoking software components may comprise other custom-developed application software, operating system functionality (e.g., device drivers, data storage (e.g., file management) routines, other common routines and services, etc.), or third-party software components (e.g., middleware, encryption, or other security software, database management software, file transfer or other network communication software, mathematical or statistical software, image processing software, and format translation software).

Software components associated with a particular solution or system may reside and be executed on a single platform or may be distributed across multiple platforms. The multiple platforms may be associated with more than one hardware vendor, underlying chip technology, or operating system. Furthermore, software components associated with a particular solution or system may be initially written in one or more programming languages, but may invoke software components written in another programming language.

Computer-executable program instructions may be loaded onto a special-purpose computer or other particular machine, a processor, or other programmable data processing apparatus to produce a particular machine, such that execution of the instructions on the computer, processor, or other programmable data processing apparatus causes one or more functions or operations specified in any applicable flow diagrams to be performed. These computer program instructions may also be stored in a computer-readable storage medium (CRSM) that upon execution may direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means that implement one or more functions or operations specified in any flow diagrams. The computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational elements or steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process.

Additional types of CRSM that may be present in any of the devices described herein may include, but are not limited to, programmable random access memory (PRAM), SRAM, DRAM, RAM, ROM, electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the information and which can be accessed. Combinations of any of the above are also included within the scope of CRSM. Alternatively, computer-readable communication media (CRCM) may include computer-readable instructions, program module(s), or other data transmitted within a data signal, such as a carrier wave, or other transmission. However, as used herein, CRSM does not include CRCM.

Although embodiments have been described in language specific to structural features and/or methodological acts, it is to be understood that the disclosure is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as illustrative forms of implementing the embodiments. Conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments could include, while other embodiments do not include, certain features, elements, and/or steps. Thus, such conditional language is not generally intended to imply that features, elements, and/or steps are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without user input or prompting, whether these features, elements, and/or steps are included or are to be performed in any particular embodiment. 

What is claimed is:
 1. A tankless liquid heater system for detecting buildup on a heating element, the tankless liquid heater system comprising: a chamber; at least one heating element configured to heat liquid in the chamber; at least one sensor configured to detect data associated with identifying buildup on the at least one heating element; and at least one device configured to: receive the data detected by the at least one sensor; determine, based on the data, an amount of the buildup on the at least one heating element; and adjust an operation of the at least one heating element based on the amount of the buildup on the at least one heating element.
 2. The tankless liquid heater system of claim 1, wherein the at least one sensor comprises a flow sensor, and wherein the data comprise a flow rate of the liquid.
 3. The tankless liquid heater system of claim 1, wherein the at least one sensor comprises an inlet temperature sensor, and wherein the data comprise an inlet temperature of the liquid.
 4. The tankless liquid heater system of claim 1, wherein the at least one sensor comprises an outlet temperature sensor, and wherein the data comprise an outlet temperature of the liquid.
 5. The tankless liquid heater system of claim 1, wherein the at least one sensor comprises a temperature sensor configured to detect the temperature of the at least one heating element, and wherein the data comprise the temperature of the at least one heating element.
 6. The tankless liquid heater system of claim 1, wherein the at least one sensor comprises an infrared sensor, and wherein the data comprise thickness data of the buildup.
 7. The tankless liquid heater system of claim 1, wherein the at least one sensor comprises a pressure sensor, and wherein the data comprise a pressure of the liquid.
 8. The tankless liquid heater system of claim 1, wherein the at least one sensor comprises a resistance sensor, and wherein the data comprise a resistance of the at least one heating element.
 9. The tankless liquid heater system of claim 1, wherein the at least one device is on or within the tankless liquid heater system.
 10. The tankless liquid heater system of claim 1, wherein the at least one device is remote from a device comprising the chamber, the at least one sensor, and the at least one heating element.
 11. The tankless liquid heater system of claim 1, wherein the at least one device is further configured to generate an alert indicating the amount of the buildup on the at least one heating element.
 12. A tankless liquid heater device for detecting buildup on a heating element, the tankless liquid heater device configured to: receive, from at least one sensor configured to detect data associated with identifying buildup on at least one heating element configured to heat liquid, the data; determine, based on the data, an amount of the buildup on the at least one heating element; and adjust an operation of the at least one heating element based on the amount of the buildup on the at least one heating element.
 13. The tankless liquid heater device of claim 12, wherein the data comprise a flow rate of the liquid.
 14. The tankless liquid heater device of claim 12, wherein the data comprise an inlet temperature of the liquid.
 15. The tankless liquid heater device of claim 12, wherein the data comprise an outlet temperature of the liquid.
 16. The tankless liquid heater device of claim 12, wherein the data comprise a temperature of the at least one heating element.
 17. The tankless liquid heater device of claim 12, wherein the data comprise thickness data of the buildup.
 18. The tankless liquid heater device of claim 12, wherein the data comprise a pressure of the liquid.
 19. The tankless liquid heater device of claim 12, the data comprise a resistance of the at least one heating element.
 20. A method for detecting buildup on a heating element of a tankless liquid heating system, the method comprising: receiving, by a controller device of a tankless liquid heating system, sensor data from at least one sensor of the tankless liquid heating system; determining, by the controller device, based on the sensor data, an amount of buildup on at least one heating element of the tankless liquid heating system; and adjusting, by the controller device, an operation of the at least one heating element based on the amount of the buildup on the at least one heating element. 